Microstructure Evolution in Preparation of Cu-Sn Contact Wire for High-speed Railway

Ming Yan; Yu Cai Wu; Jing Chao Chen; Xiao Long Zhou

doi:10.4028/www.scientific.net/AMR.415-417.446

Paper Titles

Research on the Inclusive Materials of the Rice Direct Sowing Technology with Seed Tape
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Rapid Prototyping for Treatment of Cranial Reconstruction Surgery
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Treatment of Printing and Dyeing Wastewater by the Iron Scurf and Flue Dust Internal Electrolysis Method
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Characterization of LiClO₄-SiO₂ Composite Electrolyte Prepared by Modified Sol-Gel Method
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Microstructure Evolution in Preparation of Cu-Sn Contact Wire for High-speed Railway
p.446

Modified Model for Static Behavior of Microcantilever Gas Sensor Adsorbed with Monolayer Molecules
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Study on Optimization Design of a Hoist Roller
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Low Temperature Preparation of ZnIn₂S₄ by Hydrothermal Method and its Visible Light Photocatalytic Property
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Crystal Structures of New Compounds Na_0.5Sm_4.5Ti₄O₁₅ and Na_0.5Eu_4.5Ti₄O₁₅
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Microstructure Evolution in Preparation of Cu-Sn Contact Wire for High-speed Railway

Abstract:

The thesis studies the microstructure evolution rule during Cu-Sn alloy preparation and processing process and its influence on material performance, provides necessary theoretical support for industrialization development of Cu-Sn contact wire for high-speed railway.