High Efficiency Precision Surface Grinding of Fused Silica

Abstract:

High efficiency and high surface integrity grinding of fused silica lens used in the ultraviolet (UV) laser transmission equipments is highly demanded. It is necessary to decrease the undeformed chip thickness for producing better surface integrity. We conducted creep feed grinding (CFG) and conventional shallow cut grinding (SCG) experiments of fused silica with a resin bond diamond wheel. Experiment results shows that owing to thinner undeformed chip thickness, the normal grinding force, radial wheel wear and P-V value of surface roughness of CFG are smaller than those of SCG at the same MRR. At the same table speed, surface roughness decreased with the increase of MRR in both CFG and SCG as a result of decreased undeformed chip thickness which is attributed to the elasticity of resin bond.

• Periodical: Advanced Materials Research (Volumes 418-420)
• Pages: 1132-1136
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.418-420.1132
• Online since: December 2011
• Authors: Peng Yao, Ya Dong Gong, Suo Xian Yuan, Nobuhito Yoshihara, Ji Wang Yan, Tunemoto Kuriyagawa
• Keywords: Creep Feed Grinding, Fused Silica, Undeformed Chip Thickness, Wheel Wear

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