The Effect of Preheating Temperature on the Microstructure and Properties of Copper by the Liquid Die Forging Technology

Gui Rong Yang; Wen Ming Song; Ying Ma; Yuan Hao

doi:10.4028/www.scientific.net/AMR.418-420.1213

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 418-420The Effect of Preheating Temperature on the...

The Effect of Preheating Temperature on the Microstructure and Properties of Copper by the Liquid Die Forging Technology

Abstract:

The copper specimen was fabricated through liquid die forging under different preheating temperature of mold condition. The effect of preheating temperature of mold on the microstructure, density, hardness, tensile strength and electrical conductivity were investigated. The results show that the crystal grain size was deceased firstly and then increased with the increasing of preheating temperature. Crystal grain was uniform and fine when the preheating temperature was 250 °C. The density of copper fabricated through liquid die forging was improved by about 5% comparing with that through static casting in metal mold. The hardness of copper fabricated through liquid die forging was HBS 85.2 when the preheating temperature was 250°C, which was higher than that at the rest preheating temperature conditions. The tensile strength was 288 MPa when the preheating temperature was 250°C. There was no obvious effect on the electrical conductivity under different preheating temperature.