Effect of Process Parameters on Deposition Rate of Electroless Ni-P Plating on AZ91D Magnesium Alloy

Hui Long Wang; Ling Yun Liu; Wen Feng Jiang

doi:10.4028/www.scientific.net/AMR.418-420.936

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 418-420Effect of Process Parameters on Deposition Rate of...

Effect of Process Parameters on Deposition Rate of Electroless Ni-P Plating on AZ91D Magnesium Alloy

Abstract:

The effects of the concentrations of NiSO₄•6H₂O, NaH₂PO₂•H₂O and complexing agents in bath, temperature, pH, SiC concentration etc. on deposition rate of electroless Ni-P plating were systematically studied. The appropriate deposition rate of electroless Ni-P plating (17μm h^-1) was obtained at the optimal conditions. The deposition reaction dynamics of electroless Ni-P plating on AZ91D magnesium alloy was discussed and the corresponding kinetic model was also determined based on the corresponding experimental results.

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Materials Processing Technology, ICAMMP2011

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Periodical:

Advanced Materials Research (Volumes 418-420)

Pages:

936-939

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.418-420.936

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Online since:

December 2011

Authors:

Hui Long Wang, Ling Yun Liu, Wen Feng Jiang

Keywords:

AZ91D Magnesium Alloy, Deposition Rate, Deposition Reaction Dynamics, Electroless Ni-P Plating

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References

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