Research on Bonding Technology Match of ENEPIG PCB of Digital Microphone

Jin Wei Yu

doi:10.4028/www.scientific.net/AMR.418-420.928

Paper Titles

Study on the Preparation and Properties of Low Permeability Coating
p.908

Enhancing the Sinterability of Chemically-Derived Tl1212 Superconducting Powders Using Nano-Sized MgO as Sintering Aid
p.914

Study on Oil-Ash Corrosion and Coal-Ash Corrosion Occurred in the Flue-Gas Side of Fossil Power Plant
p.918

Comparison of Lu₃Al₅O₁₂:Ce and LaBr₃:Ce Scintillators in Gamma-Ray Spectrometry
p.922

Research on Bonding Technology Match of ENEPIG PCB of Digital Microphone
p.928

SHS-TiC Particle Reinforced Hardface Coating Prepared by Vacuum Cladding Process
p.932

Effect of Process Parameters on Deposition Rate of Electroless Ni-P Plating on AZ91D Magnesium Alloy
p.936

Failure Analysis on the Exhaust Steel Tube Explosion of Natural Gas Compressor
p.940

Hygrothermal Characterization of Porous Building Materials-Experiment Research on Isothermal Sorption and Capillary Problem
p.944

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Research on Bonding Technology Match of ENEPIG PCB of Digital Microphone

Abstract:

By analyzing the crucial structure of digital microphone , it has character of welding and bonding technology, in order to increase reliability of PCB connecting , especially reliability of PCB for IC bonding with chip connecting , ENEPIG PCB is leaded in , and achieve the high reliability connecting . And according to the demand of bonding technology , bonding temperature, bonding machine pressure, bonding power and bonding time are elected , a series of bonding experiments have been done , obtain some related experiment data of bonding point and analyze the data , obtained the plating thickness parameter of matching with ENEPIG PCB .