Finite Element Model for Damage Detection in Three-Dimensional Cube Structures

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Abstract:

Based on three-dimensional finite element method (FEM), an accurate electro-mechanical impedance (EMI) model for a damaged cube structure is established in the paper. The damages are simulated by the reduction in Young’s modulus in the certain area of the cube structure. A coupled structural system consisting of PZT patch, bond layer and host structure is taken into account. Both the effects of the damage severity and damage propagation on EMI signatures are then investigated. The numerical computation indicates that the present EMI model can be employed to detect the damages in the structures.

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Periodical:

Advanced Materials Research (Volumes 430-432)

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1468-1471

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Online since:

January 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] V.G.M. Annamdas and C.K. Soh, Three-Dimensional Electromechanical Impedance Model for Multiple Piezoceramic Transducers-Structure Interaction, J. Aeros. Eng. Vol. 21 (2008), p.1.

DOI: 10.1061/(asce)0893-1321(2008)21:1(35)

Google Scholar

[2] V.G.M. Annamdas and C.K. Soh, An Electromechanical Impedance Model of a Piezoceramic Transducer-Structure in the Presence of Thick Adhesive Bonding, Smart Mater. Struct. Vol. 16 (2007), p.673–686.

DOI: 10.1088/0964-1726/16/3/014

Google Scholar

[3] W. Yan, J.B. Cai and W. Q Chen, Monitoring Interfacial Defects in a Composite Beam using Impedance Signatures, J. Sound Vib. Vol. 326 (2009), pp.340-352.

DOI: 10.1016/j.jsv.2009.04.030

Google Scholar

[4] W. Yan, W.Q. Chen, C.W. Lim and J.B. Cai, Application of EMI Technique for Crack Detection in Continuous Beams Adhesively Bonded with Multiple Piezoelectric Patches, Mech. Adv. Mater. Struc. Vol. 15 (2008), pp.1-11.

DOI: 10.1080/15376490701410513

Google Scholar

[5] Y. Chen, Research on Piezoelectric Impedance Tchnology for Structural Health Monitoring, Master's thesis. Zhejiang University, Hangzhou, China, (2010).

Google Scholar

[6] T. Makkonen, A. Holappa, J. Ella and M.M. Salomaa, Finite Element Simulations of Thin-film Composite BAW Resonators IEEE Transducers, Ultrason. Ferroelectr. Freq. Control. Vol. 48 (2001), p.41–58.

DOI: 10.1109/58.949733

Google Scholar

[7] X.P. Mo, Simulation and Analysis of Acoustics Transducers using the ANSYS Software, Tech. Acoust. Vol. 26 (2007), pp.1279-1290.

Google Scholar