Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package
A viscoplastic constitutive model with void damage is developed to analyze the macroscopic mechanical response and damage mechanism of lead-free solder alloy in CBGA packaging under cyclic thermal loading. The constitutive model is implemented into ABAQUS through its user defined material subroutine. Two-dimensional nonlinear finite element analysis of a ceramic ball grid array(CBGA) package is conducted to simulate the viscoplastic deformation and damage failure process of the lead-free solder joint under cyclic thermal loading. The damage model is helpful for optimization and reliability of electronic package.
Z.Y. Shen, M.N. James, W.D. Li, and Y.X. Zhao
W. N. Hao et al., "Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package ", Advanced Materials Research, Vols. 44-46, pp. 77-84, 2008