Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package

Abstract:

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A viscoplastic constitutive model with void damage is developed to analyze the macroscopic mechanical response and damage mechanism of lead-free solder alloy in CBGA packaging under cyclic thermal loading. The constitutive model is implemented into ABAQUS through its user defined material subroutine. Two-dimensional nonlinear finite element analysis of a ceramic ball grid array(CBGA) package is conducted to simulate the viscoplastic deformation and damage failure process of the lead-free solder joint under cyclic thermal loading. The damage model is helpful for optimization and reliability of electronic package.

Info:

Periodical:

Advanced Materials Research (Volumes 44-46)

Edited by:

Z.Y. Shen, M.N. James, W.D. Li, and Y.X. Zhao

Pages:

77-84

DOI:

10.4028/www.scientific.net/AMR.44-46.77

Citation:

W. N. Hao et al., "Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package ", Advanced Materials Research, Vols. 44-46, pp. 77-84, 2008

Online since:

June 2008

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Price:

$35.00

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