Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package

Wei Na Hao; Guo Zhong Chai; J. Zhou

doi:10.4028/www.scientific.net/AMR.44-46.77

Paper Titles

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Measurement on Scale-Induced Fatigue Behaviour for Railway Axle
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Thermal Stability of CoTi-Substituted Manganese-Zinc Ferrites
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Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package
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On Deformation of the Injection Mold Core
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Damaged Structural Vibration Analysis Using the Hamiltonian Matrix Perturbation Theory
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Study on Temperature-Dependent Tensile Strength of Short-Fiber-Reinforced Elastomer Matrix Composites
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Reliability Analysis of Corrosion Fatigue Crack Growth for 2024-T3 Aluminum Alloy
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Damage Constitutive Model and Failure Mechanism of Lead-Free Solder in CBGA Package

Abstract:

A viscoplastic constitutive model with void damage is developed to analyze the macroscopic mechanical response and damage mechanism of lead-free solder alloy in CBGA packaging under cyclic thermal loading. The constitutive model is implemented into ABAQUS through its user defined material subroutine. Two-dimensional nonlinear finite element analysis of a ceramic ball grid array(CBGA) package is conducted to simulate the viscoplastic deformation and damage failure process of the lead-free solder joint under cyclic thermal loading. The damage model is helpful for optimization and reliability of electronic package.