Thermal Stress Influence on Adhesion of Polyurea Protective Coating Base on Substrate Processing System in High-Speed Railway

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Abstract:

One of the negative factors of thermal is the effect on the adhesion of polymer coating. The high difference of thermal expansion coefficient between epoxy system and substrate is far, so put forward a new substrate system base on polyurethane (QTECH-112 system). To study the thermal change situation, the static strain testing and the substrate system microstrain change situation on low temperature and common temperature were tested respectively, and the mircostrain at the corners of the structure had also been tested. Results showed that both substrate systems had little microstrain in common temperature. But the epoxy system had high shrink strain under the low temperature, and caused the thermal stress, wihch could not be neglected during the concrete ; As a polyurethane elastomer, QTECH-112 system’s, thermal stress reduced by stress relaxation. The boundary of structure had limited on strain, so it should considered on structure design.

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Periodical:

Advanced Materials Research (Volumes 455-456)

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775-780

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January 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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