Study on Thermal Protection Materials Applied to Electronic Memory Embed in Aircraft

Feng Wen; Xiao Ping Yang

doi:10.4028/www.scientific.net/AMR.459.30

Paper Titles

Temperature Field Simulation of TP2 Copper Strip during Reversible Universal Hot Rolling Using Finite Element Method
p.12

The Combined Homotopy Methods for Optimizition under the Quasi-Normal Cone Condition
p.16

Finite Element Contact Analysis of Locomotive Traction Gears
p.19

Study on Analysis and Evaluation of the Industry Competitiveness in Hebei Province
p.25

Study on Thermal Protection Materials Applied to Electronic Memory Embed in Aircraft
p.30

Image Segmentation Based on Facet Model Fitting
p.35

GaAs/InGaAs Optoelectronic Switch for Triple-Logic Applications
p.40

Non-Isolated Bidirectional DC-DC Converter with Step up-down Capability Based on Energy Materials
p.44

Preparation of a Polyclonal Antibody Based Indirect Competitive ELISA for Enrofloxacin Residue
p.47

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 459Study on Thermal Protection Materials Applied to...

Study on Thermal Protection Materials Applied to Electronic Memory Embed in Aircraft

Abstract:

In order to get the perfect thermal protection materials and configuration of the electronic memory the relationship between the object temperature and time during heat transfer and the basic principles of heat and mass transfer for was analyzed. Several kinds of thermal protection structures and materials were simulated by ANSYS 10.0 and validated by experiments. The results demonstrated that nanometer aerogel is a kind of materials when placing it between memory and protective layer, 5 mm thick, makes sure the electronic memory works two hours normally in the environment at 125°C.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 459)

Pages:

30-34

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.459.30

Citation:

Cite this paper

Online since:

January 2012

Authors:

Feng Wen, Xiao Ping Yang

Keywords:

Aerogel, ANSYS, Electronic Memory, Thermal Conductivity (TC), Thermal Protection Material

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Yan Changhai, Thermal insulating mechanism and research on thermal insulating efficiency of thermal insulations of metallic thermal protection system. Master Thesis, Harbin Institute of Technology, (2006).

Google Scholar

[2] Yang Yazheng, Research progress on the thermal protection materials and structures in hypersonic vehicles, Journal of Applied Mathematics and Mechanics, vol. 29, No. 1, 2008, pp.47-53.

Google Scholar

[3] Yao Li, The optimum design of thermal equipment in power station and piping insulation. Master thesis, Huazhong University of Science and Technology, (2004).

Google Scholar

[4] Wang Bu-xuan, Engineering heat and mass transfer . Beijing, Scientific Press, (1998).

Google Scholar

[5] Zhang Guo-Zhi, Hu Ren-xi, Chen Ji-gang, Examples of finite element analysis of thermodynamics based on ANSYS10. 0. Beijing, Mechanical industry Press, (2007).

Google Scholar

[6] Ma Qingfang, Fang Rong-sheng, Hand book of thermo physical properties in engineering. Beijing, China Agriculture Press, (1976).

Google Scholar

[7] Zhan Chenyuan, Design of thermal insulation system based on ANSYS simulation, Journal of Computer Applications Technology, vol. 3, 2009, pp.34-36.

Google Scholar

[8] D. Filsinger, C. Gutmann, A. Schulz&S. Witting, Design of Thermally High-loaded Ceramic Compnents for Gas Turbines, Journal of the European Ceramic Society, 1997, (17), pp.1655-1663.

DOI: 10.1016/s0955-2219(97)00011-3

Google Scholar

[9] Myung Sool Koo, Kwansoo Chung, Jae Ryoun Youn, Reaction injection Molding of Polyurethane Foam for Improved Thermal Insulation, Journal of Polymer Engineering and Science, 2001, pp.1177-1186.

DOI: 10.1002/pen.10819

Google Scholar