Finite Element Simulation for Micro-Hole Processing with Millisecond Laser

Ke Dian Wang; Bin Liu; Wen Qiang Duan; Wen Jun Wang

doi:10.4028/www.scientific.net/AMR.459.324

Paper Titles

Technology to Drill Micro-Holes without Recast Layer by Laser on Nickel-Based Alloy
p.303

Research on Compensation Method of Temperature Drift in Pressure Sensor Using Double Wheatstone-Bridge Method
p.311

Study on Recast Phenomenon in Processing of Micro-Hole with Millisecond Laser
p.315

3-D Image Reconstruction in Optical Coherence Tomography Systems Based on VTK in OCT Systems
p.320

Finite Element Simulation for Micro-Hole Processing with Millisecond Laser
p.324

A Unified Framework for Co-Rotational Finite Element Method
p.329

Research on Automatic Programming Technology of Holes Processing Based on IGES
p.333

Discharge Speed Control of In-Pipe Detector in Gas Pipeline
p.338

Application of Zigbee Technology in Chemical Water Ultrafiltration System
p.343

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 459Finite Element Simulation for Micro-Hole...

Finite Element Simulation for Micro-Hole Processing with Millisecond Laser

Abstract:

In this paper, ANSYS, a finite element analysis software is used to simulate the change of temperature field in micro-hole processing with millisecond laser, which determines the diameter and depth of the hole drilled. The relationship between processing parameters and the hole size is plotted, so as to achieve size control of a micro-hole processing. Compared with experimental results, simulation is effective for laser processing of micro-hole and can be referenced to choose the best processing parameters.

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Periodical:

Advanced Materials Research (Volume 459)

Pages:

324-328

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.459.324

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Online since:

January 2012

Authors:

Ke Dian Wang, Bin Liu, Wen Qiang Duan, Wen Jun Wang

Keywords:

Finite Element (FE) Simulation, Micro-Hole, Millisecond Laser, Temperature Field

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References

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