Design and Tests of a Water-Cooling Micro-Channel Heat Sink Made by WEDM

Kuo Zoo Liang; A Cheng Wang; Chun Ho Liu; Lung Tasi; Yan Cherng Lin

doi:10.4028/www.scientific.net/AMR.459.609

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 459Design and Tests of a Water-Cooling Micro-Channel...

Design and Tests of a Water-Cooling Micro-Channel Heat Sink Made by WEDM

Abstract:

The purpose of this research is to design a new heat sink of water-cooling. With the aid of CAE (computer aided engineering), WEDM (wire electrical discharge machining), and the concept of micro-channel design, a heat sink of water-cooling can then be built with the merit of a smaller volume and lower thermal resistance. From this paper, results of the experiment indicate that the thermal resistance of heat sink can be decreased to 0.12 °C/W with input power of 60W, flow rate of 0.6 LPM, and a better heat dissipation with the in input power of 100W or 140W can be revealed.