The Numerical Simulation of Residual Stress in the Diffusion Bonding Joints by Different Coefficients of Linear Expansion

Abstract:

The numerical simulation of residual stress in the joints of Ti-6Al-4V and ZQSn10-10 sleeve structure when Cu and Ni as interlayer was carried out by ANSYS. The results indicate that the residual stress harmful to the joint appears in the narrow zone adjacent to Ti-6Al-4V side where intermetallic compounds formed and sharply concentrates on the top and bottom surfaces due to edge effect. When Ni as interlayer, the stress distribution resembles that of Ti-6Al-4V/Cu /ZQSn10-10 joint, larger than the value when Cu as interlayer. It is beneficial for the residual stress dropping, when the suitable interlayer adopted. For interlayer, the linear expansion coefficient is close to the base metal and modulus of elasticity is small.

• Periodical: Advanced Materials Research (Volumes 472-475)
• Pages: 1197-1200
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.472-475.1197
• Online since: February 2012
• Authors: Min Xia Song, He Zhao
• Keywords: Diffusion Bonding (DB), Interlayer, Numerical Simulation, Residual Stress

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