Multi-Resolution Analysis of Critical Dimension Line Edge Roughness

Yan Zhu Yang; Wei Zhu; Hong Bo Li; Xue Tao Zhao

doi:10.4028/www.scientific.net/AMR.472-475.2436

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 472-475Multi-Resolution Analysis of Critical Dimension...

Multi-Resolution Analysis of Critical Dimension Line Edge Roughness

Abstract:

A representation method for line edge roughness (LER) parameters based on wavelet-analysis is proposed. Multi-resolution analysis is processed on both spatial features and frequency features of line edge. Different feature details are achieved with different analysis resolution. The features of line edge are able to be represented well by wavelet analysis. And an extraction method for contour line of LER is designed based on wavelet baseline. The experimental results show that more details of LER features are obtained by multi-resolution wavelet analysis. The method is feasible to estimate the nano-scale LER. Therefore, it is possible to reduce the processing errors of nano-scale manufacturing line.

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Advanced Manufacturing Technology, ICMSE 2012

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Periodical:

Advanced Materials Research (Volumes 472-475)

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2436-2443

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.472-475.2436

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Online since:

February 2012

Authors:

Yan Zhu Yang, Wei Zhu, Hong Bo Li, Xue Tao Zhao

Keywords:

Line Edge Roughness, Nano-Scale Measurement, Wavelet Analysis

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