An Investigation on the Shear Toughness for Sn/3.0Ag/0.5Cu and Sn/37Pb Solder Ball Joints

Abstract:

Both experimental and numerical analyses into the shear toughness parameter for Sn/3.0Ag/0.5Cu and 63Sn/37Pb solder ball joints are performed. The ball shear tests are conducted at the loading speeds of 200μm/s and 300μm/s using ball joint specimens with diameters of 300, 600 and 760 μm. The failure behavior of the solder joints is quantified in terms of their fracture toughness. The results show that the shear toughness increases with an increasing solder ball diameter. Furthermore, it is shown that the Sn/3.0Ag/0.5Cu solder ball has a greater ductility than the eutectic 63Sn/37Pb solder ball. It is found that the shear toughness with great differentiability is relatively insensitive to the loading speed, and is therefore a suitable parameter with which to evaluate the ductility of solder ball joints in ball shear tests. Finally, the finite element analysis is further employed in the simulation with the software of MSC, Marc. Numerical predictions have good agreements compared with experiment ones.

• Periodical: Advanced Materials Research (Volumes 476-478)
• Pages: 2455-2458
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.476-478.2455
• Online since: February 2012
• Authors: Chao Ming Hsu, Tsung Pin Hung, Ah Der Lin, Jao Hwa Kuang
• Keywords: Ball Shear Test, Lead Free Solder Balls, Shear Energy, Toughness

References

[1] Changhee Lee, Jong-Bong Lee, Dong-Hwan Park and Suck-Joo Na: Materials Science Forum, Vol.580-582, (2008), pp.239-242

[2] Y.D.Lu, X.Q.He, Y.F.En and X. Wang: Advanced Materials Research, Vol.44-46, (2008), pp.905-910

[3] Shankargoud Nyamannavar and K. N. Prabhu: Advanced Materials Research, Vol.83-86, (2010), pp.1228-1235.

[4] Rajoo Ranjan,  Kisi Erich,  O'Connor D. J.: Advanced Materials Research, Vol.32, (2008), pp.99-102

[5] C. TC, Y. DQ, J. Lau, Z. WH, Z. XR: Electronic Components and Technology Conference, (2008), p.623