Characterization of Wafer Surface Topography after CMP

Abstract:

Characterization of the surface morphology after CMP vital refers to the roughness of surface outline at present. The two dimensional parameters characterization based on scanning the outline of surface as the test foundation already cannot satisfy the requirements of engineering; hence three dimensional detection and quantitative calculation of surface morphology can complete characterization. Characterization of surface morphology has made great development from low to high precision accuracy, from a single variety of touch probe to optical, atomic force, and other varieties, from the contact to non-contact, from two dimensions to three dimensions, from a single roughness measurement to simultaneously measurement of waviness, shape error outline information. Scanning probe microscopy can give surface topography of the whole measured area. Because discrimination all can reach the nanometer level surface roughness in x, y and z three directions, Scanning probe microscopy is suitable for measured structure with vertical structure units in nm magnitude and horizontal area in μm scale.

• Periodical: Advanced Materials Research (Volumes 476-478)
• Pages: 2603-2607
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.476-478.2603
• Online since: February 2012
• Authors: Ru Wang, Juan Wang, Ming Sun, Bao Hong Gao, Rui Xia Yang, Yu Ling Liu
• Keywords: Characterization, CMP, Roughness, Surface Morphology, Three Dimensions

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