Effects of Material Properties and Thickness of Die Attach on Package Delamination of IC Packages

Chia Lung Chang; Cheng Lun Chang; Ying Long Wang

doi:10.4028/www.scientific.net/AMR.479-481.2564

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 479-481Effects of Material Properties and Thickness of...

Effects of Material Properties and Thickness of Die Attach on Package Delamination of IC Packages

Abstract:

Finite element method is carried out to calculate the fracture mechanics parameter of interfacial cracking of TSOP (Thin Small Outline Package). Fracture mechanics approach together with finite element results are used to study the impacts of material properties and thickness of die attach on the energy release rate at crack tip of interfacial delamination between die pad and die attach. The results show that larger Young’s modulus, smaller CTE as well thinner thickness of die attach can reduce ERR at crack tip during reflow.

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Periodical:

Advanced Materials Research (Volumes 479-481)

Pages:

2564-2567

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.479-481.2564

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Online since:

February 2012

Authors:

Chia Lung Chang, Cheng Lun Chang, Ying Long Wang

Keywords:

Delamination, Die Attach, Energy Release Rate, Finite Element Method (FEM), Reflow

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