Design and Fabrication of an Improved MEMS-Based Piezoresistive Pressure Sensor

Article Preview

Abstract:

An improved piezoresistive pressure sensor is designed for harsh environment application. The highlight of this design is that the Wheatstone bridge circuit is put in lower surface of pressure diaphragm and sealed in the vacuum pressure cavity. The bridge circuit is led out by embedded Al electrodes on bonding surface. ANSYS software has been used to analyze the stress distribution of the diaphragm. By using the MEMS technology, the pressure sensor with the dimension of 1.5mm×1.5mm×500µm is fabricated. The performance of piezoresistive pressure sensor, including output, sensitivity, and nonlinearity, are investigated. The test results show that sensitivity is 20mV/V-MPa and maximum nonlinearity is 2.73%, which meet the requirements for the modern industry.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 482-484)

Pages:

318-321

Citation:

Online since:

February 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Gerhard H. Kroetz, Martin H. Eickhoff, Helmut Moeller: Sensors and Actuators 74(1999)182–189.

Google Scholar

[2] C.Malhaire*, D.Barbier: Thin Solid Films 427 (2003) 362–366.

Google Scholar

[3] Bian Tian *, Yulong Zhao, Zhuangde Jiang, et al: Sensors 2009, 9, 1382-1393.

Google Scholar

[4] G UAN Rong feng, WANG Xiaoxue: Transducer and Microsystem Technologies Vol.28 (6). (In Chinese).

Google Scholar