Temperature Field Simulation on the Connecting Rod of High Speed Press

Min Tang; Fang Jia

doi:10.4028/www.scientific.net/AMR.482-484.322

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 482-484Temperature Field Simulation on the Connecting Rod...

Temperature Field Simulation on the Connecting Rod of High Speed Press

Abstract:

This study is focused on the temperature field distribution of the connecting rod. The temperature field and the time for reaching thermal equilibrium condition of the rod in a certain working environment are examined by means of finite element analysis (FEA). A verification experiment is implemented on the connecting rod. Comparison between our experiment and simulation shows that simulation values are in good agreement with experimental data. Findings from the study are supposed to provide a basis for reduction of the thermal deformation of rod as well as for improvement of the thermal characteristics and precision of high speed press.

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Periodical:

Advanced Materials Research (Volumes 482-484)

Pages:

322-326

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.482-484.322

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Online since:

February 2012

Authors:

Min Tang, Fang Jia

Keywords:

Connecting Rod, FEA Method, Press, Temperature Field, Thermal Model

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