Numerical Simulation of TLP Bonding Process of 20 Steel Tubes

Abstract:

Finite element numerical dynamic simulation of the TLP bonding process of 20 steel tubes was conducted using ANSYS, finite element analysis software. The results show that there is a sharp decline in the performance of the joint and the neighboring parent material during the initial cooling stage in the transitional phase diffusion bonding process. When the isothermal solidification temperature is increased, the welding deformation becomes more apparent, and the residual stress on both sides of the joint is reduced. Thus, the weak area of TLP bonding can be found near the middle. A reasonable choice of interlayers can relieve stress concentration and increase the TLP bonding joint performance.

• Periodical: Advanced Materials Research (Volume 485)
• Pages: 389-392
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.485.389
• Online since: February 2012
• Authors: Heng Juan Tang, Si Jie Chen
• Keywords: 20 Steel, Finite Element, Stress Field, Temperature Field, TLP Bonding

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