The Adhesion Testing and Analysis for NiCr/NiSi Thin-Film Sensor

Abstract:

By the method of orthogonal experiment, with different sputtering power, sputtering pressure, sputtering time and substrate bias, 9 NiCr-NiSi thin-film thermocouples with different properties were prepared on the rake face of different cutting tools. With WS-2005 coating adhesion automatic scratch tester, the adhesion between the thin-film and the cutting tools were tested, and the test results was analyzed by range analysis. Analysis results show that, among four sputtering factors, substrate bias is the most important factor which influenced the thin-film adhesion. In a certain range, increasing the substrate negative bias voltage value can enhance the adhesion of thin-film. Subsequently, the range analysis result was verified by test. The best set of parameters was selected among all of the orthogonal test results, with other parameters unchanged except substrate negative bias, which was increased to -110V.And that, the adhesion value of NiCr and NiSi film was increased by 3.2N and 1.5N around individually.

• Periodical: Advanced Materials Research (Volumes 490-495)
• Pages: 3748-3752
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.490-495.3748
• Online since: March 2012
• Authors: Xiao Feng Zheng, Qi Yong Zeng, Zhu Li, Li Zheng Jiang, Feng Chen
• Keywords: Orthogonal Experiment, Range Analysis, Thin-Film Adhesion, Thin-Film Thermocouple

References

[1] Zeng qiyong, Sun Baoyuan: Development of NiCr/NiSi thin-film thermocouple sensor for cutting temperature measurement, The 6th International Symposium on Test and Measurement. 1(2005), pp.89-96.

DOI: 10.1109/wcica.2006.1713610

[2] Zeng Qiyong, Sun Baoyuan, Deng Xinlu, et al. A new fabrication method of NiCr/NiSi thin-film thermocouple sensor for workpiece temperature measurement in chemical explosive material machining, Conference Proceedings of The Sixth world Congress on Intelligent Control and Automation. 1(2006).

DOI: 10.1109/wcica.2006.1713610

[3] Ali Basti, Toshiyuki Obikawaa and Jun Shinozukab: Tools with built-in thin-film thermocouple sensors for monitoring cutting temperature, International Journal of Machine Tools & Manufacture. 23(2007), pp.793-798.

DOI: 10.1016/j.ijmachtools.2006.09.007

[4] Jehnming Lin, Shinn-Liang Lee, Cheng-I Wang: Estimation of cutting temperature in high speed machining, Journal of Engineering Materials and Technology. 12(1992), pp.289-296.

[5] Marcio Bacci da Silva, James Wallbank: Cutting temperature prediction and measurement methods-review, Journal of Material Processing Technology. 28(1999), pp.195-297.

DOI: 10.1016/s0924-0136(98)00395-1

[6] Qiu Tiebing: Experimental design and data processing(China Science and Technology University Press, Beijing2008), pp.124-135, in chinese.

[7] Zhao Xuemin. Experimental design method(Science Press, Beijing2006), pp.213-232, in chinese.

[8] T. Ueda, A. Hosokawa, A. Yamamoto: Measurement of grinding temperature using infrared radiation pyrometer with optical fibre. 4 (1986), pp.247-251.

DOI: 10.1115/1.3187074

[9] Xu Jun, Ma Tengcai, Lu Wenqi. A new method for thin-film deposition—faced microwave electron cyclotron resonance plasma source enhanced direct-current magnetron sputtering, Chinese Physics Letter, 17(2000), pp.586-588.

DOI: 10.1088/0256-307x/17/8/015

[10] Ohring M. The Material Science of Thin Films(Academic Press, Boston1992), pp.154-167.