The Development of an Ultrasonic Head for CMP Pad Conditioning

Pei Lum Tso; Shi Guo Liu; J. C. Wang

doi:10.4028/www.scientific.net/AMR.500.275

Paper Titles

Prediction of the Cutting Depth of Abrasive Suspension Jet Using a BP Artificial Neural Network
p.249

Powder Mixed near Dry Electrical Discharge Machining
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High Performance in EDM Machining of AISI D2 Hardened Steel
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Study on Surface Roughness in Ultrasonic Vibration Mill-Grinding Hot-Pressed Silicon Nitride
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The Development of an Ultrasonic Head for CMP Pad Conditioning
p.275

Study on Grinding Technology of Granite Thin Slab
p.281

Grinding Force of Ultrasonic Vibration Assisted Grinding Combined with EDM
p.287

Research on the Distribution of Grains in the Grinding Process
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Application of Image Mosaic Method in the Detection of Grinding Wheel Topography
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 500The Development of an Ultrasonic Head for CMP Pad...

The Development of an Ultrasonic Head for CMP Pad Conditioning

Abstract:

The technology of ultrasonic assisted machining has been successfully used in many machining processes recently. Conditioning in the CMP not only can extending the life of the polishing pad but also improve process stability. In this paper we develop a brand new conditioning process with ultrasonic assisted conditioning UAC head for chemical mechanical polishing CMP process. The slurry came from inside the polishing spindle and had an independent cyclic system. As a result, this UAC device can remove polishing debris 4-6 times faster than conventional conditioning process. This conditioning process may even use water instead of slurry to reduce the cost of consumables of CMP. Key word: Chemical mechanical polishing CMP, Ultrasonic assisted conditioning UAC, Polishing Pad

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Periodical:

Advanced Materials Research (Volume 500)

Pages:

275-280

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.500.275

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Online since:

April 2012

Authors:

Pei Lum Tso, Shi Guo Liu, J. C. Wang

Keywords:

CMP, Conditioning, Dressing, Ultrasonic Vibration Assisted Machining

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