Current–Voltage Characteristics of n-Al0.08In0.08Ga0.84N Schottky Diode Using Pt Metal Contact

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In this study, current-voltage (I-V) measurements at room temperature (RT) of platinum (Pt) metal contact combine with n-Al0.08In0.08Ga0.84N thin film which grown epitaxially by molecular beam epitaxy (MBE) technique on sapphire substrate to form Schottky diode have been characterized. Schottky barrier heights of diode related with the high work function metal of Pt electrode was measured and investigated. Pt metal was fabricated using RF-sputtering technique. The effect of annealing temperature ranged from 300 °C to 600 °C on the structural and electrical properties has been studied. The results revealed that in spite of the various annealing temperature used there is no change in XRD diffraction peak observed in Pt contact. Furthermore, at 400 °C the best surface morphology was obtained and the value of SBH and ideality factor (n) was 0.76 eV and, 1.03 respectively. This concludes that at this annealing temperature Pt metal exhibited optimum (I-V) rectifying characteristics of Pt/Al0.08In0.08Ga0.84N Schottky diode.

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226-230

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April 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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