A Method of Recycling Waste Solution of Copper Plating Using Cyanidation in Laboratory

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Abstract:

The method of recycling waste solution of copper plating using cyanidation in laboratory involves the comprehensive utilization of waste solution in the electroplating field. The method includes the following steps: first, add activated carbon into the waste to remove the organic impurities, lower the temperature of the waste with cooling fin and form sediments to remove carbonate salt in it. Add sodium sulfide, alizarin into the waste, and the containing heavy metal element Pb2+, Zn2+ and Cr3+ in it precipitate through chemical reactions. Place the waste solution in the closed container and make cyanide hydrolyze to produce non-toxic sodium formate and ammonia by adding alkali and under heat and pressure conditions. It provides an easy and convenient method, which can effectively recover resources, and reduce pollution for recycling copper cyanide waste solution in laboratory.

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Periodical:

Advanced Materials Research (Volumes 503-504)

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266-269

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Online since:

April 2012

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© 2012 Trans Tech Publications Ltd. All Rights Reserved

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[1] The harm of copper plating using cyanidation to environment and people, Health basic knowledge on National security management website, (2004).

Google Scholar

[2] Liming Feng, Hua Sun, Yue Wang, Xicheng Ma, Electroplating process and equipment, Chemical industry Publish, Beijing, (2005).

Google Scholar

[3] Miaogen Qian, Material surface technology and its application manual, Chuanxin Hu, Surface treatment technology handbook, (2005).

Google Scholar

[4] Chuanxin Hu, Surface treatment technology handbook, (2006).

Google Scholar

[5] Guoying Li, Surface engineering manual, (2008).

Google Scholar

[6] Liming Feng, Yue Wang, Electroplating technology, (2007).

Google Scholar

[7] Yuncheng Zhang, Runan Hu, Rong Xiang, Electroplating manual, third ed., Defense industry Publish, Beijing, (2007).

Google Scholar