Solidification Path Calculations of Al-Cu-Si Alloys in Al-Rich Corner

Wei Guang Zhao; Xi Cong Ye; Wen Jun Liu; Ming Chun Gu

doi:10.4028/www.scientific.net/AMR.503-504.374

Paper Titles

Film Morphology and Film-Forming Ability of Supramolecular Compound Self-Assembled with Amino Polysiloxane Emulsion and Carboxyl Polysiloxane Emulsion
p.358

Stress Analysis in Ceramic Inlays Restored Premolars
p.363

Research on Water Cut of Silicon Steel Plate
p.367

Measurement of SiC Particle Size Based on Ultrasonic Attenuation Spectrum
p.370

Solidification Path Calculations of Al-Cu-Si Alloys in Al-Rich Corner
p.374

Studies on the Microstructure and Properties of TiO₂/(Ag) Thin Films
p.378

The Effects of Machined Workpiece Surface Integrity on the Fatigue Life of TC21 Titanium Alloy
p.382

Calculation and Plot of Predominance Area Phase Diagram for Cu-S-O Ternary System
p.390

Study on Reaming High-Precision Thin Hole in Hardened Steel by Ultrasonic Vibration Reamer
p.396

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 503-504Solidification Path Calculations of Al-Cu-Si...

Solidification Path Calculations of Al-Cu-Si Alloys in Al-Rich Corner

Abstract:

The solidification path of Al-Cu-Si alloys in the Al-rich corner are investigated. The thermodynamic data needed in the calculation are obtained by direct coupling with the CALPHAD software Thermo-Calc. A paralell experimental investigation is conducted to validate the prediction results. The calculated results show that, the sensitivity of the variations in the solidification paths to the cooling rates are depended on the distance of the initial compositions from the binary eutectic troughs or the ternary eutectic point. Reasonable agreements are observed between the predicted amounts of θ-phase and the measured results.