Fabrication and Calibration of Cu-Ni Thin Film Thermocouples

Abstract:

Thin film thermocouples (TFTCs) have vast vistas owing to their advantages, such as thin junction, small volume, fast response rate, high sensitivity and so on. In this investigation, a transient temperature sensor of TFTCs was fabricated to measure the surface transient temperature by vacuum coating technology. Silicon dioxide was selected as insulating substrate, the overall dimension of which was 8 mm long, 8 mm wide, and 0.1 mm thick. Two different metal layers were sandwiched between silicon dioxide 2 insulating substrate and silicon dioxide protective layer: cuprum and nickel films, which were 0.08 μm thick. TFTCs consist of 13 Cu-Ni junctions, which are connected in series. The whole TFTCs area is 4.6mm × 4.6 mm. The aggregate thickness of the transient temperature sensor is 0.17 μm. To protect Cu and Ni films, a silicon dioxide layer thickness of 0.01 μm was evaporated on metal layers excluding terminal points. This research carried out static and dynamic calibration to TFTCs. The Seebeck coefficient of the thin film thermocouple is 0.83843 μV/°C. The dynamic performance of TFTCs exhibited dynamic behavior corresponding to the heat flux change on the surface of thin film thermocouple.

• Periodical: Advanced Materials Research (Volumes 512-515)
• Pages: 2068-2071
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.512-515.2068
• Online since: May 2012
• Authors: Hang Guo, Jun Ying Jiang, Jia Xing Liu, Zhi Hua Nie, Fang Ye, Chong Fang Ma
• Keywords: Calibration, Dynamic Response, Thin Film Thermocouple, Transient Temperature Sensor

References

[1] Y. Heichal, S. Chandra and E. Bordatchev: Experimental Thermal and Fluid Science Vol. 30 (2005), p.159

[2] Hui Xue, Fuguo Li and lvquan Huang: Journal of Transducer Technology Vol. 1 (1996), p.46 (In Chinese)

[3] Hongren Zhou, Xiurong Liu, Xiaosong Du, Beina Xu and Bangchao Yang: Global Electronics China Vol. 1 (1999), pp.58-59 (In Chinese)

[4] K.G. Kreider: Journal of Crystal Growth Vol. A (1986), pp.2618-2623

[5] Fuguo Li, Lvquan Huang, Yajun Xie and Jincheng Shui: Chinese Journal of Scientific Instrument Vol. 17 (1996), pp.316-318 (In Chinese)

[6] Jing Xu, Baoyuan Sun and Qiyong Zeng: Instrument Technique and Sensor Vol. 6 (2005), pp.1-3

[7] X.G. Zhang, H. Choi, A. Datta and X.C. Li: Journal of Micromechanics and Microengineering Vol. 16 (2006), pp.900-905

[8] Lvquan Huang and Fuguo Li: China Mechanical Engineering Vol. 7 (1996), pp.34-36 (In Chinese)