Numerical and Experimental Study on Fabrication of Microstructure Array with Topographical Gradient via Through-Mask EMM

Article Preview

Abstract:

To obtain textured surface with low friction and high fluid load support capacity, in this work, based on the basic tenet of fluid film lubrication theory that converging gap is the first necessary condition to generate a hydrodynamic pressure in a confined fluid film, a fabrication method via through-mask electrochemical micromachining (EMM) for microstructure array on metal substrate with topographical gradient in a single micromachining step is investigated. After analyzing the factors that influence the current density distribution on the anode surface in EMM process, three potentially feasible schemes are presented and their fabrication results are predicted through numerical simulation. Combining the simulation results with practical application requirements, the scheme with machining gap gradient is adopted. With the selected fabrication scheme, the experiments are performed and the microstructure array with a feature size of 25μm and a height variance from 12μm to 24μm within 2mm distance has been produced successfully, which is in good agreement with the numerical calculation prediction.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

254-258

Citation:

Online since:

June 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] A.A.G. Bruzzone, H.L. Costa, P.M. Lonardo, D.A. Lucca.: CIRP Ann-Manuf Techn Vol. 57(2)(2008), p.750.

Google Scholar

[2] I. Etsio: J Tribol-T ASME Vol. 127(1)(2005), p.248.

Google Scholar

[3] H.L. Costa, I.M. Hutchings: Tribl Int Vol. 40(8)(2007), p.1227.

Google Scholar

[4] P. Luchini, F. Manzo, A. Pozzi.: J AIAA Vol. 30(8)(1992), p.2168.

Google Scholar

[5] H.A. Spikes: Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology, Vol. 217(1)(2003), p.1.

Google Scholar

[6] F. Sahlin, S.B. Glavatskih, T. Almqvist, R. Larsson: J Tribol-T ASME Vol. 127(1)(2005), p.96.

Google Scholar

[7] D. Landolt, P.F. Chauvy, O. Zinger: Electrochim Acta Vol. 48(20-22)(2003), p.3185.

Google Scholar

[8] R. Schuster, V. Kirchner, P. Allongue, G. Ertl: Science Vol. 289(5476)(2000), p.98.

DOI: 10.1126/science.289.5476.98

Google Scholar

[9] R.V. Shenoy, M. Datta: J Electrochem Soc 143(2)(1996), p.544.

Google Scholar

[10] Q.D. Wang, J.M. Xiao, Y. Li: Adv Mater Res, 2011, 189-193: 692-696.

Google Scholar