Research on the Interlayer Stress and Warpage Deformation in FDM

Abstract:

Abstracts: Fused deposition modeling (FDM), a representative prototyping technology with no use of toxic materials, has been widely used in offices. The reason of interlayer stress and warpage deformation are analyzed in this paper. Under certain conditions, the calculating formula of interlayer stress and the stress-distributing diagram in cut planes are provided, and the mathematical model for warpage deformation calculation is also established. Besides, the influence of the various process parameters on the deformation, such as the number of deposition layers, scanning line length, chamber temperature, and layer thickness, is quantitatively analyzed with measurements provided to minimize deformation.

• Periodical: Advanced Materials Research (Volumes 538-541)
• Pages: 1564-1567
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.538-541.1564
• Online since: June 2012
• Authors: An Hua Peng*
• Keywords: Fused Deposition Modeling (FDM), Interlayer Stress, Process Parameter, Warpage Deformation

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