Effect of In, Bi, Zn Binary-Metal Dopings in Sn-0.7Cu Solder on its Electrochemical Corrosion Charateristics in 3 wt.% NaCl Solution

Abstract:

Effect of In, Zn, Bi binary-metal dopings in Sn-0.7Cu (SC) solder on the electrochemical corrosion characteristics of SC solder were conducted, the potentiodynamic polarization test coupled with SEM analyses had been widely used to study the corrosion properties of alloy materials. The results showed that when both In-Zn binary-metal doping was increased, the corrosive current density (I_corr) increased, which proved that anti-corrosion capacities of Sn-0.7Cu solder decreased with In-Zn doping increasing, the affected order was Zn>In. When both In-Bi binary-metal doping percent were increased, the corrosive current density (I_corr) decreased, the affected order was In>Bi. When both Zn-Bi binary-metal doping percent were increased, the Icorr increased, the affected order was Zn>Bi. There was collaborated function on SC solder for the three metals. The synthesized result showed that the sequence of In, Bi, Zn affecting on corrosion of SC solder was that Zn>In>Bi, which provide a support data to improve soldering reliability in electronic packagings.

• Periodical: Advanced Materials Research (Volume 548)
• Pages: 286-292
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.548.286
• Online since: July 2012
• Authors: L. Hua, L. Zhang
• Keywords: Binary-Metal Dopings, Electrochemical Corrosion Charateristic, Potentiodynamic Polarization, Sn-0.7Cu Solder

References

[1] Directive 2002/95/EC of the European Parliament and of the Council. On the restriction of the use of certain hazardous substances in electrical and electronic equipment [J]. Official Journal of the European Union, 2003, 23: 19-37.

[2] D.Q. Yu, C.M.L. Wu, L. Wang, The electrochemical corrosion behavior of Sn9Zn and Sn-8Zn-3Bi lead-free solder alloys in NaCl solution, in: 16th International Corrosion Conference, Beijing, China, 2005, 19-24.

DOI: 10.4028/www.scientific.net/amr.1095.95

[3] M. Abtew, G. Selvaduray, Lead-free solders in microelectronics, Materials Science and Engineering, 2000, 27: 95-141.

DOI: 10.1016/s0927-796x(00)00010-3

[4] M. N. Islam, Y. C. Chan, A. Sharif, et al. Effect of 9 wt. % In addition to Sn3. 5Ag0. 5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads, Journal of Alloys and Compounds, 2005, 396: 217-223.

DOI: 10.1016/j.jallcom.2005.01.001

[5] J.S. Hwang, Z. Guo, H. Koenigsmann, Surf. Mount Technol., 2001, 13 (2): 7–13.

[6] T. C. Chang, J. W. Wang, M. C. Wang, et al. Solderability of Sn-9Zn-0. 5Ag-1In lead-free solder on Cu substrate, Part 1: Thermal properties, microstructure, corrosion and oxidation resistance. Journal of Alloys and Compounds, 2006, 422: 239-243.

DOI: 10.1016/j.jallcom.2005.09.094

[7] L. Hua, X. P. Guo, J. K. Yang, Effects of Bi doping on electrochemical corrosion and dendrite growth suppression of lead-free Sn-3. 0Ag-0. 5Cu solder, The Chinese Journal of Nonferrous Metals, 2012, 22(1): 1-7.

[8] F. J. Wang, X. Ma, Y. Y. Qian, Improvement of microstructure and interface structure of eutectic Sn-0. 7Cu solder with small amount of Zn addition, Scripta Materialia, 2005, 53: 699-702.

DOI: 10.1016/j.scriptamat.2005.05.013

[9] H. Oulfajrite, A. Sabbar, M. Boulghallat, A. Jouaiti, R. Lbibb, A. Zrineh, Electrochemical behavior of a new solder materials (Sn-In-Ag), Materials Letters, 2003, 57: 4368-4371.

DOI: 10.1016/s0167-577x(03)00326-4

[10] R. Mahmudi, A. R. Geranmayeh, M. Salehi, H. Pirayesh, Impression creep of the rare-earth doped Sn-2%Bi lead-free solder alloy, Journal of Materials Science: Materials in Electronics, 2010, 21(3): 262-269.

DOI: 10.1007/s10854-009-9903-6

[11] L. Hua, H. N. Hou, H. Q. Zhang, T. Wu, Y. H. Deng, Effects of Zn, Ge doping on electrochemical migration, oxidation characteristics and corrosion behavior of lead-free Sn-3. 0Ag-0. 5Cu solder for electronic packaging, Proceedings of the 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010), 2010: 1151-1157.

DOI: 10.1109/icept.2010.5582749

[12] D. Z. Li, P. C. Paul, C. Q. Liu, Corrosion charaterization of tin-lead and lead free solders in 3. 5wt. % NaCl solution, Corrosion Science, 2008, 50: 995-1004.

DOI: 10.1016/j.corsci.2007.11.025

[13] G. Saad, A. Fawzy, E. Shawky, Effect of Ag addition on the creep characteristics of Sn-8. 8wt. %Zn solder alloy, Journal of Alloys and Compounds, 2009, 479: 844-850.

DOI: 10.1016/j.jallcom.2009.01.069

[14] A. A. EI-Daly, A. E. Hammad, Development of high strength Sn-0. 7Cu solders with the addition of small amount of Ag and In, Journal of Alloys and Compounds, 2011, 509, 8554-8560.

DOI: 10.1016/j.jallcom.2011.05.119

[15] L. Hua, M. W. Su, W. J. Zhang, Q. L. Hu, Electrochemical migration and rapid whisker growth of Zn and Bi dopings in Sn-3. 0Ag-0. 5Cu solder in 3wt. % NaCl solution, Advanced materials Research, 2011, 239-242: 1751-1760.

DOI: 10.4028/www.scientific.net/amr.239-242.1751

[16] A. Ahmido, A. Sabbar, H. Zouihri, et al. Effect of bismuth and silver on the corrosion behaviour of Sn-9Zn alloy in NaCl 3 wt. % solution, Materials Science and Engineering B, 2011, 176: 1032-1036.

DOI: 10.1016/j.mseb.2011.05.034