A New Reliability Prediction Method Based on Physics of Failure Method for Product Design and Manufacture

Article Preview

Abstract:

Different from the reliability prediction method on handbook, the reliability prediction method based on Physics of Failure (PoF) model takes failure mechanism as theoretical basis, and combines the design in-formation with the environment stress of the product to predict the time to failure. When the uncertain of the parameters is considered to predict the reliability, Monte-Carlo calculation method is always used here. How-ever, the Monte-Carlo method needs large computational cost, especially for large and complicated electronic systems. A new reliability prediction method which combines the first order reliability with the reliability pre-diction method based on PoF model was proposed. The new method utilized the first order method to calculate the position of design point and reliability index, thus Monte-Carlo calculation process was avoided. Example calculation results showed that the new method improves the prediction efficiency without decreasing the accuracy of reliability, thus it is feasible for reliability prediction of electronic product in engineering.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

521-526

Citation:

Online since:

July 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2012 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Economou M. The merits and limitations of reliability predictions [J]. RAMS IEEE, vol. 3, pp.352-357, April (2004).

Google Scholar

[2] L. Yang, P.A. Agyakwa and C.M. Johnson.A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects [J]. Microelectronics Reliability, August (2011).

DOI: 10.1016/j.microrel.2011.07.052

Google Scholar

[3] Salvatore Liguore, David Followell. Vibration Fatigue of Surface Mount Technology Solder Joint[C]. Reliability and Maintainability Symposium, Washington DC, USA, (1995).

DOI: 10.1109/rams.1995.513218

Google Scholar

[4] Chen yunxia, Xie Wenshu, Zeng Shengkui. Functional Analysis and Physics of Failure Associated Reliabililtiy Prediction[J]. Acta Aeronautica et Astronautica Sinica, vol. 29, pp.1133-1138, May (2008).

Google Scholar

[5] Zhang Jianguo, Su Duo, Liu Yingwei. Reliability analysis and optimization of mechanical products [M]. Beijing: Publishing House of Electronics Industry, (2008).

Google Scholar

[6] Zhao Yu, Xie Jinsong. Generic electromigration physics of failure model of semiconductor component [A]. The 11th Chinese electronics society Physics of failure Symposium, pp.77-83, (2005).

Google Scholar

[7] Engelmaier, W. Generic Reliability Figures of Merit Design Tools for Surface Mount Solder Attachments[J]. IEEE Trans. CHMT, vol. 16, pp.103-112, January (2003).

DOI: 10.1109/33.214866

Google Scholar