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Determination of the Curing Techniques of Octaepoxysilsesquioxane with a Diamine
Abstract:
Octaepoxysilsesquioxane (POSS-Ep), a kind of functional polyhedral oligomeric silsesquioxane (POSS) was cured with 4,4'-diaminodiphenylsulfone diamine (DDS) in this study. Possessing epoxy groups, it can be cured thermally with certain curing agents including amines. Differential scanning calorimetry (DSC) was used to determine the curing techniques of the POSS-Ep/DDS resin system in this study. The appropriate curing technique for this resin is set as: 130°C/2h+ 160°C/2h+200°C/2h.
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157-160
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July 2012
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© 2012 Trans Tech Publications Ltd. All Rights Reserved
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