The Three-Dimensional Analysis of Light Scattering Characters for Rayleigh Particles On/Below the Wafer

Abstract:

Laser light scattering is a powerful tool for its noncontract nature and its convenience to nondestructive examination in the semiconductor industry. Taking the advantage of the scattering matrixes, the models of particulate contaminants on the wafer and subsurface defects are established, respectively. And the bidirectional reflectance distribution functions are derived. The results show that when the Rayleigh particle is on the wafer, the variation of BRDFpp is smooth without gulch for a definite incident angle. However, there is a gulch with the increment of scattering angle and the position of gulch is reduced with the increment of incident angle. When the Rayleigh particle is below the wafer, with an identical incident angle, there is a gulch with the variation of scattering azimuth angle. In addition, BRDFpp becomes larger and larger with the incident angle of p polarization light increment. The conclusions provide theoretical basis for quality evaluation and identify the information of contaminants detected in the semiconductor industry.

• Periodical: Advanced Materials Research (Volume 571)
• Pages: 347-351
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.571.347
• Online since: September 2012
• Authors: Lei Gong, Zhen Sen Wu, Ya Qing Li
• Keywords: Bidirectional Reflectance Distribution Function, Rayleigh Particles, Scattering Matrix, Wafer

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