Thermal Analysis Study on Packaging Materials of Power-LED

Yi Bing Liu

doi:10.4028/www.scientific.net/AMR.588-589.1849

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 588-589Thermal Analysis Study on Packaging Materials of...

Thermal Analysis Study on Packaging Materials of Power-LED

Abstract:

In this paper, a high power- LED package model has been built. Different bonding materials and substrate materials have been chosen. Having performed simulations of the temperature field by ANSYS finite element software, the conclusions are drawn as follows: nanometer silver paste has the best heat transfer characteristics; ALN is an ideal substrate material because of its lowest junction temperature, thermal resistance and the maximum heat load when the junction temperature reaches120 ° C .

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Periodical:

Advanced Materials Research (Volumes 588-589)

Pages:

1849-1853

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.588-589.1849

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Online since:

November 2012

Authors:

Yi Bing Liu

Keywords:

ANSYS, Bonding Materials, Power-LED, Substrate Material

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References

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