Experimental Inverstigation on Thermal Expansion Coefficients of SnO2 Thin Film

Jing Wang; Hong Lai Li; Mei Hua Liu

doi:10.4028/www.scientific.net/AMR.591-593.965

Paper Titles

Influence of Smoke on Metallographic Structure of Short Circuited Melted Mark
p.945

Constitutive Modeling of the Rate-Dependent Behavior of Ti-6Al-4V Using an Arrhenius-Type Law
p.949

The Influence of Different Subbase Materials on the Crack of Cement Stabilized Macadam Base during Construction
p.955

An Experimental Study on Lubrication Behavior of Glass Lubricants during Hot Plastic Deformation of Ni-Based Alloys
p.960

Experimental Inverstigation on Thermal Expansion Coefficients of SnO₂ Thin Film
p.965

Test on Electrical Conductinity of Oil Shale
p.969

Thermodynamic Analysis of a Brown Glass Containing Fe, C and S
p.973

The Responses of Soft Ground Materials Subjected to Dynamic Loading
p.977

Preparation and In Vitro Degradation of PLGA/HA Composite Fiber Scaffolds by Electrospinning
p.982

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Experimental Inverstigation on Thermal Expansion Coefficients of SnO₂ Thin Film

Abstract:

As a kind of wide band-gap material focused on in recent years, SnO₂ thin Film with μm level has been widely applied in many fields such as solar cells, electric heating devices, transparent electrodes, and gas sensors, ect. This paper develops a real-time system to measure thermal expansion coefficients of SnO₂ thin film, which can obtain directly surface morphology information of the samples. Micro-imaging and digital image correlation method is adopted to investigate the correlation by comparing the object surface image before deformation with that after deformation. Because of the lower demand for measurement environment and no damage to object, it’s easy to acquire on-line images, calculate synchronously and display real-time results. In the paper, thermal expansion coefficients of SnO₂ thin film are determined in situ with change of the temperature. Both of ceramic and SnO₂ thin film have shown anisotropy thermal expansion, thermal and residual stress appears between the ceramic substrate and SnO₂ thin film as a result of thermal expansion coefficients mismatch. According to experimental results, the maximum stress values can be calculated between film and substrate and inside the substrate.