Flow and Heat Transfer in Microchannels of the MTPV Systems

Abstract:

Heat transfer and flow characteristics in the microchannel cooling passages with three different types of the MTPV systems are numerically investigated. This investigation covers Reynolds number in the range of 100 to 1000 and heat flux ranged from 50kW/m² to 150kW/m². The steady, laminar flow and heat transfer equations are solved in a finite-volume method. Results such as temperature distribution, heat transfer coefficient, pressure drop and friction factor are reported. A comparison of the heat transfer coefficient and friction factor of the different microchannels are also presented. The heat transfer performance of the rod bundles microchannel is found to be much better than others. Both friction factor and heat transfer coefficient are increased as the Reynolds number increased.

• Periodical: Advanced Materials Research (Volumes 614-615)
• Pages: 181-185
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.614-615.181
• Online since: December 2012
• Authors: Ge Ping Wu, Ping Lu
• Keywords: Microchannel Cooling Passages, MTPV Systems, Numerical Simulation

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