Optical Energy Gap and Microhardness of Cu3N Thin Films

Article Preview

Abstract:

The paper mainly reviewed the optical energy gap and microhardness of Cu3N thin films. The optical energy gap increases from 0.23 eV to 1.9 eV. The microhardness of Cu3N thin films was determined to be about 3.7-8.8 GPa.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

277-279

Citation:

Online since:

December 2012

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2013 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Terao N, Acad C. R. Sci. Paris Ser., B 1973; 277: 595.

Google Scholar

[2] Hahn U, Weber W. Electronic structure and chemical-bonding mechanism of Cu3N, Cu3NPd, and related Cu (I) compounds[J]. Phys. Rev. B, 1996; 53: 12684~12693.

Google Scholar

[3] Asano M., Umeda K, Tasaki A. Cu3N thin film for a new light recording media[J]. Jpn. J. Appl. Phys., 1990; 29 (10): 1985~(1986).

DOI: 10.1143/jjap.29.1985

Google Scholar

[4] Maya L. Mater. Res. Soc. Symp. Proc. 1993; 282: 203.

Google Scholar

[5] Maya L. Deposition of crystalline binary nitride films of tin, copper, and nickel by reactive sputtering[J]. J. Vac. Sci. Technol. A, 1993 11(3): 604.

DOI: 10.1116/1.578778

Google Scholar

[6] Maruyama T., Morishita T. Copper nitride thin films prepared by redio-frequency reactive sputtering, J. Appl. Phys., 1995; 78 (6): 4104.

DOI: 10.1063/1.359868

Google Scholar

[7] Pierson J. F., Structure and properties of copper nitride films formed by reactive magnetron sputtering, Vacuum 2002; 66: 59-64.

DOI: 10.1016/s0042-207x(01)00425-0

Google Scholar

[8] Nosaka T., Yoshitake M., Okamoto A., et al. Copper nitride thin films prepared by reactive radio-frequency magnetron sputtering, Thin Solid Films 1999; 348: 8-13.

DOI: 10.1016/s0040-6090(98)01776-3

Google Scholar

[9] Wang D. Y., Nakamine N., Hayashi Y., Properties of various sputter-deposited Cu-N films, J. Vac. Sci. Technol. A, 1998; 16 (4): (2084).

Google Scholar

[10] Liu Z. Q., Wang W. J., Wang T. M., Chao S., Zheng S. K. Thermal stability of copper nitride films prepared by rf magnetron sputtering, Thin Solid Films, 1998; 325: 55~59.

DOI: 10.1016/s0040-6090(98)00448-9

Google Scholar

[11] Gordillo N, et al. DC triode sputtering deposition and characterization of N-rich copper nitride thin films: Role of chemical composition. Journal of Crystal Growth 2008; 310 : 4362–4367.

DOI: 10.1016/j.jcrysgro.2008.07.051

Google Scholar

[12] F. Fendrych, L. Soukup, L. Jastrabik, M. Sicha, Z. Hubicka, D. Chvostova, A. Tarasenko, V. Studnicka, and T. Wagner, Diamond Relat. Mater. 8 (1999) 1715.

Google Scholar