Mechanical Performance of Ti/Cu-8Ag/S20C Clad Composite Processed by High Pressure Torsioning (HPT)

Abstract:

Ti/Cu-8Ag/S20C composite were processed by High Press Torsioning(HPT) and the effect of post-HPT heat treatment on the interfacial reaction products and the mechanical performance were studied. Intremetallic compound layer with the thickness of 11 μm was observed at the interface between Ti and Cu-8Ag for the clad heat-treated at 600°Cfor 24hrs. On the other hand, no intermetallic compounds were observed at the Cu-8Ag/S20C interface. No cracks were observed to be emanated from the corner of the indentation mark on the intremetallic compound layer at the Ti/Cu-8Ag interface, suggesting those intermetallic compounds is not so brittle. The stress-strain curves exhibited two steps in as-HPTed clad samples and those heat-treated at 600°C for 24hrs. The careful examination of the fractured plates revealed that S20C plate fractured first and then Ti and Cu-8Ag layers fractured together, suggesting the bonding strength between two layers is fairly high in the presence of intermetallic layer between Ti and Cu-8Ag layers

• Periodical: Advanced Materials Research (Volume 625)
• Pages: 323-327
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.625.323
• Online since: December 2012
• Authors: Jun Young Song, Jong Su Ha, In Kyu Kim, Sun Ig Hong
• Keywords: Clad Material, Diffusion Bonding (DB), High Pressure Torsioning, Ti/Cu-8Ag/S20C Interface

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