Research on Laser Induced Thermal-Crack Propagation Cutting Silicon Wafer

C.Y. Zhao; Hong  Zhi Zhang; Y. Wang

doi:10.4028/www.scientific.net/AMR.628.211

Paper Titles

Effect of Doped Cobalt on Performance of Tungsten Filament
p.187

Hybrid Welding of AA5754-H111 Alloy Using a Fiber Laser
p.193

Parameter Optimization in Al6061/HIF GA Steel Friction Stir Lap Welds
p.199

A Friction Stir Welding Platform of Thin Plates
p.206

Research on Laser Induced Thermal-Crack Propagation Cutting Silicon Wafer
p.211

Sensitivity Study on Parameters for Fatigue-Creep Modeling of Stainless Steel Materials
p.217

Research on Box Drawing Coefficient of Friction Based on Dynaform
p.223

Application and Research of the Design Process of Concept A-Surface
p.229

Improving the Performance of the Cluster Identification Algorithm for Grouping in Advanced Manufacturing
p.240

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 628Research on Laser Induced Thermal-Crack...

Research on Laser Induced Thermal-Crack Propagation Cutting Silicon Wafer

Abstract:

Laser molten cutting silicon wafer was focused more recently, but this method has the material loss disadvantage. So this paper indicates the finite element simulation and experiments of cutting silicon wafer with YAG laser induced thermal-crack propagation. A theoretical model of a thermal laser shock method for separation of the silicon wafer is developed, and the fracture propagation mechanism is studied by the stress fields using finite element software ABAQUS. Optical microscope and laser scan confocal microscope (LSCM) photographs of the separation surface and path are obtained to examine the cutting quality. The impact of technological parameters on the cutting quality is studied and the optimum processing parameters are presented in the paper.

You might also be interested in these eBooks

Manufacturing Engineering and Technology for Manufacturing Growth

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 628)

Pages:

211-216

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.628.211

Citation:

Cite this paper

Online since:

December 2012

Authors:

C.Y. Zhao, Hong Zhi Zhang, Y. Wang

Keywords:

Continuous YAG Laser, Finite Element Analysis (FEA), Induced Thermal-Crack Propagation, Silicon Wafer

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Y.F. Fan, The status quo and the technical innovation of the MEMS scribing technology, J. Semiconductor Technology. 4 (2008) 296-299.

Google Scholar

[2] Y.J. Deng, Laser cutting technology and the application to the ceramic materials, J. Machinery. 31 (2004) 55-57.

Google Scholar

[3] Sybille Hopman, Kuno Mayer, Andreas Fell, Laser cutting of silicon with the liquid jet guided laser using a chlorine-containing jet media, J. Applied Physics A Materials Science & Processing. 102(2011)621-627.

DOI: 10.1007/s00339-010-6155-5

Google Scholar

[4] J. Zhang, X.H. Peng, Study of laser cutting technology for silicon wafer under water, J. Chinese Journal of Lasers. 36(2009)3064-3067.

DOI: 10.3788/cjl20093611.3064

Google Scholar

[5] F. Zhang, H. Yang, Study of 355nm solid-state ultraviolet laser cutting technology for silicon wafer. The sixteenth national semiconductor integrated circuit silicon academic meeting. (2009).

Google Scholar

[6] J. Liu, J. Lu, Thermal stress cleaving of silicon wafer by pulsed Nd: YAG laser, J. Chinese Optics Letters. 8(2010)1000-1003.

Google Scholar

[7] T. Ueda, K. Yamada, Thermal stress cleaving of brittle materials by laser beam, J. Manufacturing Technology. 51(2002)149-152.

DOI: 10.1016/s0007-8506(07)61487-5

Google Scholar

[8] W.H. Wu, Glass thermal stress cleaving technology based on laser, J. Instruments Today. 29(2008)33-44.

Google Scholar