Analysis of UV Laser Machining Process for High Density Embedded IC Substrates

Sung Jun Park; Jung Han Song; Geun An Lee

doi:10.4028/www.scientific.net/AMR.630.171

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 630Analysis of UV Laser Machining Process for High...

Analysis of UV Laser Machining Process for High Density Embedded IC Substrates

Abstract:

New manufacturing process capable of high density patterns has been required. The most popular technique used today to form such fine pitch conductors is Semi-Additive Process(SAP) or variations of semi-additive process. New manufacturing method focus on the technologies designed to produce a smooth interface between resin and copper conductors for advantages in the high frequency application and fine conductor pitch capabilities. In this study, laser microprocessing was investigated for resin materials with various filler size, and was selected by suitable materials with processability and physical characteristics.

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Periodical:

Advanced Materials Research (Volume 630)

Pages:

171-174

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.630.171

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Online since:

December 2012

Authors:

Sung Jun Park, Jung Han Song, Geun An Lee

Keywords:

Build-Up Film, Embedded Pattern, Laser Processing

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References

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