Study of Transient Liquid-Phase Bonding of SiC Particle Reinforced Aluminum Matrix Composite

Abstract:

Transient liquid-phase(TLP) bonding of SiC particle reinforced aluminum matrix composite(SiCp/Al MMCs) ,using Cu film, Cu foil, Ni foil and Cu/Ni/Cu multilayer foil interlayer, was investigated. The effect of surface status, interlayer species and bolding time on bonding microstructure and properties were also estimated by metallographic microscope, scanning electron microscopy (SEM), X ray diffraction and tensile testing machine. The results show that adding holding time can improve shear strength of joint. Better strength of joint can be obtained due to without the effect of oxide with Cu film as interlayer, when bonding at 853K for 120min under 2MPa pressure, the shear strength of bonded joints can obtain 169.1MPa, about 81.7 percentage of the strength of base material. Best strength of joint can be obtained with Cu/Ni/Cu multilayer foil as interlayer, when bonding at 923K for 120min under 2MPa pressure, the of bonded joints can obtain 189.6MPa, about 84.6 percentage of the strength of base material.

• Periodical: Advanced Materials Research (Volumes 631-632)
• Pages: 44-49
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.631-632.44
• Online since: January 2013
• Authors: Yao Chu, Shi Hang Jiang, Wei Jian Fan, Zhao Yang Jin, Du Xiong Wang
• Keywords: Cu/Ni/Cu Interlayer, SiCp/Al MMCs, Strength of Bonding, Transient Liquid Phase (TLP) Bonding

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