Adsorption of Cu (II) on Thiourea Impregnated Gelatin Microspheres

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Abstract:

In this study, we describe a novel adsorbent, thiourea impregnated gelatin microspheres(TIGM) which were synthesized from thiourea impregnated gelatin by inverse suspension polymerization with glutaraldehyde as crosslinker. With the aim to investigate the absorption kinetics of Cu(II) on TIGM, the absorption equilibrium, the effects of temperature on the absorption was fully discussed. It was found that this adsorbent is effective for the removal of Cu(II) from aqueous solutions. Results of the experiments presented that the thiourea was uniformly dispersed in microspheres mainly through chemical bonds, and the adsorption isotherms of Cu(II) on TIGM fits well both with the classical Freundlich equation and the Langmuir equation. It was also suggested that the adsorption rate of Cu (II) was faster at higher temperature, and the amount of the adsorption also increases with the increasing of temperature. According to the research, the maximal adsorption capacity is obtained when pH is 5 to 9, and the adsorption kinetics of Cu(II) onto TIGM could be described by pseudo-first-order rate mode.

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Advanced Materials Research (Volumes 634-638)

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187-191

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January 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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