Quantifying Full Field Surface Deformation in Organic Insulators under Electrical Stress with DIC

Abstract:

Applications of the digital image correlation method (DIC) for the determination of the full filed surface deformation, induced by a DC electrical field in organic insulator thin films, are investigated in this paper. Digital images of the film sample at different voltages were recorded and processed to obtain the full-field surface deformation associated with electrical stress changes. Considerable work has been carried out to describe the various parameters at play during the electrical ageing process of organic insulators from displacement field measurements. The result shows that the approximation method can smoothly reconstruct the experimentally obtained displacement field.

• Periodical: Advanced Materials Research (Volume 647)
• Pages: 676-682
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.647.676
• Online since: January 2013
• Authors: Belkacem Yousfi, Boubakeur Zegnini, Juan Martinez-Vega
• Keywords: Digital Image Correlation (DIC), Electrical Ageing, Electromechanical Deformation, Nondestructive Testing (NDT), Organic Insulator

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