Numerical Simulation of Laser Soldering about Electronic Connectors

Yi Liu; Xun Bo Li; Zhi Zeng; Tao Liu

doi:10.4028/www.scientific.net/AMR.668.534

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 668Numerical Simulation of Laser Soldering about...

Numerical Simulation of Laser Soldering about Electronic Connectors

Abstract:

A transient thermal model for Micro USB V2.0 electronic connector was created based on 3D finite element method. Then get the laser soldering spots on the temperature and stress the distribution of simulation by ANSYS software. Temperature fields at different time, residual stress in different locations and deformations were analyzed. The result shown that the maximum deformation of metal-pin reached 1.4mm, achieved the process standard.

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Periodical:

Advanced Materials Research (Volume 668)

Pages:

534-537

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.668.534

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Online since:

March 2013

Authors:

Yi Liu, Xun Bo Li, Zhi Zeng, Tao Liu

Keywords:

Connector, Deformation, Laser Soldering, Numerical Simulation

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References

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