Study on Parameters Optimization in Ultra-Precise Processing of Germanium Substrate

Abstract:

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To improve efficiency in ultra-precision lapping germanium (Ge) substrate, a new ultra-precise process technology is introduced in this paper. Two steps ultra-precise process were semi bonded abrasive lapping in rough machining, and CMP process in finish machining. A good surface quality workpiece was obtained in semi bonded abrasive lapping process efficiently. Several machining parameters were compared and applied. After CMP process, the mirror-like surface of Ge substrate was obtained.

Info:

Periodical:

Advanced Materials Research (Volumes 69-70)

Edited by:

Julong Yuan, Shiming Ji, Donghui Wen and Ming Chen

Pages:

442-445

DOI:

10.4028/www.scientific.net/AMR.69-70.442

Citation:

X. Lv et al., "Study on Parameters Optimization in Ultra-Precise Processing of Germanium Substrate", Advanced Materials Research, Vols. 69-70, pp. 442-445, 2009

Online since:

May 2009

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Price:

$35.00

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