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Study on Parameters Optimization in Ultra-Precise Processing of Germanium Substrate
Abstract:
To improve efficiency in ultra-precision lapping germanium (Ge) substrate, a new ultra-precise process technology is introduced in this paper. Two steps ultra-precise process were semi bonded abrasive lapping in rough machining, and CMP process in finish machining. A good surface quality workpiece was obtained in semi bonded abrasive lapping process efficiently. Several machining parameters were compared and applied. After CMP process, the mirror-like surface of Ge substrate was obtained.
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442-445
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Online since:
May 2009
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© 2009 Trans Tech Publications Ltd. All Rights Reserved
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