The Nano-Cutting Mechanism Research of Polysilicon Based on Molecular Dynamics

Abstract:

Molecular dynamics model of the polysilicon material under the micro/nanoscale is established by using molecular dynamics method, make variety of the typical defects distribute to the polysilicon model reasonable and relax the simulation model, obtain the system potential energy curves in the relaxation process and the atomic location figure after the relaxation. Conduct molecular dynamics simulation of nanometric cutting process relying on the development of simulation program, get instant atom position image and draw the cutting force curve. Discusses the typical defects impact on the polycrystalline silicon nanometric cutting process, those mainly include cutting force changes in the cutting process, potential energy changes and processed surface quality etc.

• Periodical: Advanced Materials Research (Volumes 690-693)
• Pages: 2559-2562
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.690-693.2559
• Online since: May 2013
• Authors: Ying Zhu, Shun He Qi, Zhi Xiang, Ling Ling Xie
• Keywords: Molecular Dynamic (MD), Nanometric Cutting, Polysilicon

References

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