Influence of Reflow Soldering Process Parameters on the Lead-Free Reflow Profile

Abstract:

Reflow soldering process parameters have distinct effect on the lead-free reflow profile and its key indicators. To determine the relationship between reflow soldering process parameters and lead-free reflow profile is significant for obtaining the correct reflow profile. The result of orthogonal experimental shows that the most influential factors of the change rate of heat-up R_S are conveyor speed S, temperature set value of the heating zone 1 T₁ and the temperature set value of heating zone 2 T₂ in sequence; the most influential factors of the soaking time T_S are conveyor speed S, the temperature set value of heating zone 4 T₄ and the temperature set value of heating zone 2 T₂ in sequence; the most influential factors of the reflow peak temperature P_T are conveyor speed S, the temperature set value of heating zone 7 T₇ and the temperature set value of heating zone 6 T₆ in sequence; the most influential factors of the reflow time T_AL are conveyor speed S and the temperature set value of heating zone 6 T₆ in sequence.

• Periodical: Advanced Materials Research (Volumes 690-693)
• Pages: 2578-2582
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.690-693.2578
• Online since: May 2013
• Authors: Wan Lei Liang, Xiao Dan Guan, Peng Zhao
• Keywords: Lead-Free Soldering, Orthogonal Experimental Design, Reflow Profile, Reflow Soldering, Reflow Soldering Process Parameters

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