Research for Viscoplastic Behaviors of SAC405 Pb-Free Solder

Ying Mei Li; Tian Yu Zhao; Jun Liu; Bao Zong Huang

doi:10.4028/www.scientific.net/AMR.690-693.2686

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 690-693Research for Viscoplastic Behaviors of SAC405...

Research for Viscoplastic Behaviors of SAC405 Pb-Free Solder

Abstract:

Aiming at Pbfree solder Sn4.0Ag0.5Cu (in short, SAC405), the uniaxial tensile tests are accomplished with constant strain-rate under different temperature and strain-rate load conditions. The elastic-viscoplastic behaviors of SAC405 solders are studied. The rate-dependent material main properties are analyzed, such ad yield limit, tensile strength, saturation stress, etc. Partitioned constitutive model is accepted to describe the constitutive behavior of SAC405 solder. The seven parameters in partitioned model are determined by experiment data. The results of numerical simulation are fitted with the experimental values.

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Periodical:

Advanced Materials Research (Volumes 690-693)

Pages:

2686-2689

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.690-693.2686

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Online since:

May 2013

Authors:

Ying Mei Li, Tian Yu Zhao, Jun Liu, Bao Zong Huang

Keywords:

Constitutive Equation, Pb-Free Solder, Rate-Dependent, Visco-Plasticity

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