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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 706-708Strain-Rate Characteristic of the Brush Plated...

Strain-Rate Characteristic of the Brush Plated Nanocrystalline Cu

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Abstract:

In this study, the pure nanocrystalline Cu columns were fabricated by the brush electrodeposition technique at 20°C and at different deposition current densities in the range of 200 240 mA cm^-2. The columns shows high strain rate sensitivity in the room temperature compressive test. In the tested strain rate range, the strength of the nanocrystalline Cu at 2% plastic strain increases from 660 MPa to 1500 MPa. The nanocrystalline Cu exhibits obvious flow softening behavior at high strain level, and the degree of the softening is related to the strain rate.

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Periodical:

Advanced Materials Research (Volumes 706-708)

Pages:

262-265

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.706-708.262

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Online since:

June 2013

Authors:

Feng Du, Jing Li, Yue De Gao, Wen Jun Han

Keywords:

Compression, Electro-Deposition, Nanocrystalline Cu, Surfactant

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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