Multi-Objective Optimization Design of Multi-Layer Rectangle Micro-Channel Heat Sink for Single-Phase Flow and Heat Transfer

Abstract:

The purpose of this paper is to optimize the structural sizes of multi-layer rectangle micro-channel heat sink, which has been widely used to cool electronic chip for its high heat transfer coefficient and compact structure. Taking the thermal resistance and the pressure drop as goal functions, a binary-objective optimization model was proposed for the multi-layer rectangle micro-channel heat sink based on Sequential Quadratic Programming (SQP) method. The number of optimized micro-channel in width n₁ and that in height n₂ are 21 and 7, the width of optimized micro-channel W_c and fin W_f are 340 and 130μm, the height of optimized micro-channel H_c is 415μm, and the corresponding total thermal resistance of the whole micro-channel heat sink is 1.3354 °C/W. The corresponding pressure drop is about 1.3377 Pa. When the velocity of liquid is larger than 0.3 m/s, the effect of change of velocity of liquid on the thermal resistance and pressure drop can be neglected.

• Periodical: Advanced Materials Research (Volume 709)
• Pages: 286-291
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.709.286
• Online since: June 2013
• Authors: Li Feng Wang, Bao Dong Shao, He Ming Cheng
• Keywords: Heat Transfer, Multi-Layer Micro-Channel Heat Sink, Optimization Design, Pressure Drop, Thermal Resistance

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