Effects of Heat Treatment on the Creep Crack Growth Behavior in Al/Al-4wt%Cu Functionally Graded Material

Shuang Yu; Wei Dong; Fu Min Xu; Ming Bi Fu; Yi Tan

doi:10.4028/www.scientific.net/AMR.711.81

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 711Effects of Heat Treatment on the Creep Crack...

Effects of Heat Treatment on the Creep Crack Growth Behavior in Al/Al-4wt%Cu Functionally Graded Material

Abstract:

A conventional hot-pressing method was used to produce Al/Al-4wt%Cu functionally graded material (FGM). Heat treatment, which included solid solution treatment (T4) and aging treatment (T6), was carried out on hot-pressed (F) specimens. The creep crack growth tests were performed under constant loading of the creep-testing machines. The distribution of copper composition was investigated by line analysis via electron probe microanalysis. Fracture morphology and creep crack paths were studied by scanning electron microscopy. During heat treatment, the thickness of the graded transition layer increased due to copper composition redistribution. Creep crack growth retardation was found when crack propagated from the graded transition region to the Al-4wt%Cu layer. Greater improvement in creep crack growth resistance was achieved by the T4 and T6 states of Al/Al-4wt%Cu FGM. For T4 and T6 state specimens, the micro-cracks and crack kinking in the transition region were observed, which prevented creep crack growth.