Material Flaw Sizing by Ultrasonic Multipath Detection

Abstract:

Sizing of material flaw is addressed in the multipath scene, and a method is developed to detect an isolated sized flaw and estimate its height based on imaging theory of different path profiles. A signal model based on the multipath higher order reflections of the flaw is built to detect the sized flaw. Multipaths are predicted and identified on the basis of the direct reflection path, which is relatively easy to be identified using the conventional flaw detection techniques. Direct reflection path and combined path are applied to detect the flaw from the top, and multipath w is to detect its bottom of the flaw. Ultrasonic imaging is formed and synthesized by all the identified multipaths, which shows the size of the material flaw. Simulations and experimentations demonstrate that the flaw sizing can be calculated utilizing the time-of-arrivals of the multipath signals.

• Periodical: Advanced Materials Research (Volumes 712-715)
• Pages: 1067-1070
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.712-715.1067
• Online since: June 2013
• Authors: Xi Zhong Shen*, Pan Li
• Keywords: Flaw, Multipath, Sizing, Ultrasonic Imaging

References

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DOI: 10.1155/2012/874081

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DOI: 10.1201/9781315218144-3

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DOI: 10.1109/icassp.2012.6288425